JPH089621Y2 - 圧力変換器 - Google Patents
圧力変換器Info
- Publication number
- JPH089621Y2 JPH089621Y2 JP1989041342U JP4134289U JPH089621Y2 JP H089621 Y2 JPH089621 Y2 JP H089621Y2 JP 1989041342 U JP1989041342 U JP 1989041342U JP 4134289 U JP4134289 U JP 4134289U JP H089621 Y2 JPH089621 Y2 JP H089621Y2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- joint member
- pressure sensor
- diaphragm
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 27
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 19
- 238000012545 processing Methods 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000007740 vapor deposition Methods 0.000 claims description 7
- 239000007789 gas Substances 0.000 description 22
- 239000010409 thin film Substances 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 229910052814 silicon oxide Inorganic materials 0.000 description 9
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000012495 reaction gas Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000009530 blood pressure measurement Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000001272 nitrous oxide Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052990 silicon hydride Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989041342U JPH089621Y2 (ja) | 1989-04-06 | 1989-04-06 | 圧力変換器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989041342U JPH089621Y2 (ja) | 1989-04-06 | 1989-04-06 | 圧力変換器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02131639U JPH02131639U (en]) | 1990-11-01 |
| JPH089621Y2 true JPH089621Y2 (ja) | 1996-03-21 |
Family
ID=31551927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989041342U Expired - Fee Related JPH089621Y2 (ja) | 1989-04-06 | 1989-04-06 | 圧力変換器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH089621Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2576171Y2 (ja) * | 1991-10-15 | 1998-07-09 | 三菱重工業株式会社 | 補強プレート付樹脂ファン |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650270B2 (ja) * | 1984-05-21 | 1994-06-29 | 株式会社日本自動車部品総合研究所 | 高圧用圧力検出器 |
| JPS61137242U (en]) * | 1985-02-14 | 1986-08-26 | ||
| JPS63195537A (ja) * | 1987-02-09 | 1988-08-12 | Fuji Electric Co Ltd | 絶対圧形半導体圧力センサ |
-
1989
- 1989-04-06 JP JP1989041342U patent/JPH089621Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02131639U (en]) | 1990-11-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |